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X-Ray & Optical Inspection
Manufacture Master employs a state-of-the-art x-ray system as part of our SMD 1st off procedure, and batch sampling process to closely monitor production performance, with the ability to perform bump analysis we can closely monitor reflow processes and ensure quality and confidence is maintained when traditional inspection techniques are inadequate for the inspection of BGA, LGA, QFN, and other devices where the connections are hidden.
Our X-ray inspection can also aid in the diagnosis of CEM repairs and internal defect analysis through non-destructive testing and investigation of solder defects enabling the inspector to ‘walk through’ an assembly helps find faults such as broken tracks or barrels in a PCB for example, as well as any issues with leadless components.
Our X-ray system can also provide non-destructive inspection of other manufactured components such as cable assemblies or machined parts where there is a need to see interior detail or for checking incoming components to detect counterfeit devices.
Optical Inspection
Our Optical Inspection capabilities include inline AOI (automated optical inspection) used to aid 1st off procedures (first article) increasing efficiency and during production for continuous quality monitoring for SMD and PTH assemblies ensuring quality and consistency is built into every product.
Manufacture Master offers state of the art manual microscopy inspection with up to 330x magnification capability and large digital displays we can inspect and continuously monitor quality in fine detail.
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